Whether it is at the CCA, module or box level we have the test engineering experience and test facility resources to meet the needs of your program. Every product is unique and has its own set of test requirements. Let our engineers develop a test program that is tailored to your needs through the product lifecycle.
Trust Beyond Manufacturing ®- Complex Products
- Troubleshooting
- Reliability testing
- Environmental testing
- Test software development
- Test development
- Fixture design
- Trust
- Design for test (DFx)
- Test set design to spec
Test Development & Support
You can focus on product development and getting products to market faster while Sypris designs production test equipment to meet your testing specifications. Sypris offers end-to-end test equipment design, fabrication, test software development, and measurement system analysis and verification.
We have developed test sets for our customers for design verification testing and then integrated these test sets into production to ensure measurement method alignment into production.
Key Services:
- Test system development that works in conjunction with your product engineers
- Broad spectrum performance specification testing and fault detection
- Development support for test requirements plan
- Qualifying and maintaining customer or government-provided test equipment
- Fixture design inclusive of holding, inter-mating, high current, high frequency connections, complex control interface platforms
- Detailed signal parametric data optimizing fault characterization and effective root-cause analysis
- Continuity/isolation testing to power supplies, complex automated analog/digital to RF synthesizers, solid state power amplifiers, high frequency up/down converters
Have a technical challenge?
Our test engineering team is here to help with your unique product.
In Process Testing
Sypris Electronics also specializes in transferring your product or program from the engineering prototype state into initial production.
Sypris has many options for in-process testing to ensure the best possible coverage for your specific design features.
Key Features:
- Inline solder paste 3D inspection to ensure process control of the solder paste printing process
- Automated optical inspection to confirm part presence, polarity, correct part, and solder
- X-ray inspection (2D & tilt) to verify process control of bottom terminate solder joint components
- Flying probe electrical testing to screen for manufacturing defects by measuring resistance, capacitance, inductance, shorts, and opens (ideally suited for lower to medium volume products and early life-cycle products
Have a technical challenge?
Our test engineering team is here to help with your unique product.
In Circuit Testing
We have broad capabilities that can be tailored to your product needs to handle your in circuit testing.
Key Features:
- Highest test coverage at circuit card assembly level
- Keysight 3070 test equipment running Windows OS
- JTAG
- In-circuit bed-of-nails testing to provide a higher level of electrical test coverage at the CCA/PCBA level. This test also provides scalable options including continuity, electrical measurements and basic powered functional testing
Have a technical challenge?
Our test engineering team is here to help with your unique product.
Product Testing
Failure in the field is not an option — your mission-critical product must work as intended. We help ensure your product is built and tested according to your requirements. Our experienced test engineering team will work with you to develop your test strategy and to ensure your product executes as required in its field application. Our expertise extends to multiple severe environments such as space flight and undersea applications.
Key Features:
- Product Testing
- Digital expertise
- Analog expertise
- Radio frequency (RF) expertise
- Requirement test design
- Fixture design
- Full data collection, analytics and performance management
- Functional test, design and development
- Solutions-based trouble shooting
- Six Sigma approach
Have a technical challenge?
Our test engineering team is here to help with your unique product.
Reliability & Environmental Testing
Thermal and Vibration Environmental Stress Screening (ESS) is a method used to compress product testing into a shorter duration by subjecting the product under test to extreme environments. The objective of this type of testing is to weed out early life failures.
Key Features:
- A customized plan linked to functional design test plan
- Thermal cycling (-60 to +150C; 25C/minute ramp)
- Environmental stress screening (ESS)
- Accelerated aging/burn in
- Mil-STD _810
- Vibration environmental stress screening product profile development with optimized incipient fault precipitation
Have a technical challenge?
Our test engineering team is here to help with your unique product.